Compact model for solder bump electromigration failure

  • Helena Cerić, Siegfried Selberherr
  • Published 2015 in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

Abstract

The mechanical and electrical properties of solder bumps influence the overall reliability of 3D ICs. In this paper we present a compact model for prediction of the mean-time-to-failure of solder bumps under the influence of electromigration.

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